Log in

Register Subscribe
The Home of Textile Innovation

WAKO – Researchers in Japan claim to have developed a method of integrating electronic components within fabric substrates without impeding the material’s flexibility. 

Academics at the Riken Centre for Emergent Matter Science (CEMS) and the Riken Cluster for Pioneering Research used water vapour plasma – rather than heat or adhesives – to fix gold electrodes onto polymer films. 

Senior research scientist, Kenjiro Fukuda, commented: “We expect this new method to become a flexible wiring and mounting technology for next-generation wearable electronics that can be attached to the clothes and skin. The next step is to develop this technology for use with cheaper metals, such as copper or aluminium.” 

Why Subscribe?

T.EVO BACK ISSUE ARCHIVE
OTHER PUBLICATIONS FROM MCL GLOBAL

Weekly e-news bulletin

Latest news direct to your inbox

Interested in advertising?

Simply give us a call

Sales: +44 1977 708488

Or if you prefer email, click on the button below and we'll get back to you asap

 

Why Subscribe?

Looking beyond the cutting edge of textile innovation allows you to stay well ahead of the competition. That’s exactly what you get through a subscription to T.EVO – which delivers a refreshing new take on the rapid evolution of today’s dynamic textile sector.

Key T.EVO benefits:

You will learn about:

All this from MCL Global – the fastest growing international textile publisher – which can now offer today’s textile industry a unique preview of how today’s industry will look tomorrow.

In print, online and mobile device formats.