WAKO – Researchers in Japan claim to have developed a method of integrating electronic components within fabric substrates without impeding the material’s flexibility.
Academics at the Riken Centre for Emergent Matter Science (CEMS) and the Riken Cluster for Pioneering Research used water vapour plasma – rather than heat or adhesives – to fix gold electrodes onto polymer films.
Senior research scientist, Kenjiro Fukuda, commented: “We expect this new method to become a flexible wiring and mounting technology for next-generation wearable electronics that can be attached to the clothes and skin. The next step is to develop this technology for use with cheaper metals, such as copper or aluminium.”
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